MM，Machine Model：As the machine contacts the chip, static electricity is discharged through the pins with simulating the accumulation of static electricity on equipment. Because the equivalent resistance of the machine is 0 ohms, it will generate larger current to cause potential damage to chip. However, most of the current standard specifications have canceled the MM electrostatic test mode.
3 types of tests, HBM, MM and CDM comparison chart of discharge time and current: comparison chart of discharge current of static electricity mode for human body (2KV), static electricity mode for machine (200V) and charge mode for component (1KV).
The latch-up test mainly refers to the specification of JEDEC 78 and the definition of AEC-Q100-004. In the test of automotive electronics, the definition shall conform to Class II, the maximum ambient temperature condition, which is more rigorous than traditional normal temperature.
Transmission Line Pulse (TLP) test is a advanced simulation method for electrostatic discharge of semiconductor products. TLP has obtained an I-V point and increased continuously by employing one pulse condition each time, until the leakage exceeds the specification value.
Snapback phenomena often occur as performing TLP test. There is a t1 trigger point at Vt1 in snapback protection device. As the ESD instantaneous discharge energy continuously supplies the protection device, the characteristic curve of the protection device will get into the snapback area. However, as the ESD instantaneous discharge energy continues to supply the protection device, the characteristic curve of the protection device will also form a low-resistance discharge path to discharge the ESD instantaneous discharge energy. When the voltage and current keep on rising to It2, this is the maximum current that the chip can withstand and also known as the second breakdown point to cause the chip will not restore its original characteristics.
VESP Technology Corp. ESD Lab is possessed of a complete range of services and adopts equipment including MK2, MK4, Orion2, Orion3. At present, it has introduced a new generation of Hanwa ESD test machines from Japan. In addition to Hsinchu in Taiwan, there are service machines in Shanghai Zhangjiang Hi-Tech Park and National Sensor Center in Jiading District, which can provide customers with rapid verification services. Furthermore, TLP has been deployed in Zhangjiang branch of Shanghai that can assist R & D developers to verify the integrity of the ESD protection designs of the chip immediately and help customers’ products to be launched in the market.